TMM-150-03-F-D
Parameters
| Product Status | Active |
| Connector Type | Header |
| Contact Type | Male Pin |
| Pitch - Mating | 0.079" (2.00mm) |
| Number of Positions | 100 |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.079" (2.00mm) |
| Number of Positions Loaded | All |
| Style | Board to Board or Cable |
| Shrouding | Unshrouded |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Length - Mating | 0.157" (4.00mm) |
| Contact Length - Post | 0.106" (2.69mm) |
| Overall Contact Length | 0.323" (8.20mm) |
| Insulation Height | 0.059" (1.50mm) |
| Contact Shape | Square |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 3.00μin (0.076μm) |
| Contact Finish - Post | Tin |
| Contact Material | Phosphor Bronze |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Features | - |
| Operating Temperature | -55°C ~ 125°C |
| Ingress Protection | - |
| Material Flammability Rating | - |
| Insulation Color | Black |
| Current Rating (Amps) | 3.2A per Contact |
| Voltage Rating | - |
**Product Highlights** The TMM-150-03-F-D showcases several key design highlights that enhance its performance and reliability: * **Material Selection:** The header is typically constructed with high-performance materials such as Liquid Crystal Polymer (LCP) insulators, which offer excellent thermal and electrical properties. The contacts are often made of a copper alloy, providing good conductivity and durability. * **Tin-Plated Contacts:** Tin-plated contacts provide an excellent solderability for the surface-mount process. This ensures a robust and reliable electrical connection to the PCB. * **Precision Manufacturing:** Samtec employs advanced manufacturing techniques to ensure the highest levels of precision and consistency in every TMM-150-03-F-D. This translates into improved signal integrity and a longer product lifespan. * **Compliance and Certifications:** Samtec products are typically manufactured to comply with all relevant industry standards, including RoHS compliance, and are tested to ensure their reliability and performance.
**Application Scope** The versatility of the TMM-150-03-F-D makes it suitable for a wide array of applications across various industries: * **Consumer Electronics:** Used in smartphones, tablets, and other portable devices where space is a premium. The high-density design helps to miniaturize the devices. * **Industrial Automation:** Used in control systems, sensors, and other industrial equipment where ruggedness and reliability are essential. The secure connections and robust construction can handle tough industrial environments. * **Medical Devices:** Employed in medical imaging equipment and diagnostic devices, where the reliable performance and precise signal transmission are paramount. * **Test and Measurement Equipment:** Used in oscilloscopes, signal generators, and other test and measurement devices that demand high performance and signal integrity. * **Networking and Communications:** Utilized in network equipment, routers, and switches, where high-speed data transfer and reliable connections are critical. * **Automotive Electronics:** Increasingly, it's finding use in automotive control units, infotainment systems, and other onboard electronics.
In conclusion, the Samtec TMM-150-03-F-D is an advanced interconnect solution that offers significant advantages, combining high density, surface mount technology, and a robust design. Its versatility makes it applicable for various applications, providing reliable performance across numerous industries. From consumer electronics to complex industrial systems, the TMM-150-03-F-D's adaptability and high-performance capabilities make it an excellent choice for modern electronic designs.